๐ป Microchannel Heat Sink Sizer (MCHE)
Design microchannel heat sinks for high-power electronics (CPU/GPU/SiC): junction temperature Tj, total thermal resistance Rth (K/W), heat flux density (W/cm2), and pressure drop.
โก Fortran 90 Engine
Double Precision (IEEE 754)
โ ISO / ASME Validated
Heat Exchangers
๐ Solver Telemetry
โ ACTIVE
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22
โก Solves
21
๐พ Downloads
239
๐ฆ Fortran Code
4.1 KB
๐
Released
Jun 2026
โฑ๏ธ Latency
< 1 ms
๐ฌ High-Density Microchannels & Thermal Heat Spreading
Real-time visual simulation: Micro-fin array with liquid coolant streams and heat conduction vectors๐ Configuration & Presets
๐ค 700W AI Datacenter GPU
๐ฅ๏ธ 350W Server Direct-to-Silicon
๐ 1200W EV SiC Inverter
๐งช FC-72 Immersion Sink
Tuckerman & Pease Microchannel Formulation:
โข Total Resistance: Rth = Rconv + Rcond + Rcaloric [K/W]
โข Convective Resistance: Rconv = 1 / (h ยท Aeff) [K/W]
โข Fin Efficiency: ฮทfin = tanh(mยทHc) / (mยทHc)
โข Junction Temperature: Tj = Tin + Q ยท Rth [ยฐC].
โข Total Resistance: Rth = Rconv + Rcond + Rcaloric [K/W]
โข Convective Resistance: Rconv = 1 / (h ยท Aeff) [K/W]
โข Fin Efficiency: ฮทfin = tanh(mยทHc) / (mยทHc)
โข Junction Temperature: Tj = Tin + Q ยท Rth [ยฐC].
๐ Thermal Performance Results
Configure inputs and click Compute to view results.
๐ Calculation Methodology & Electronics Cooling Standards
Tuckerman & Pease Microchannel Paradigm
By reducing hydraulic diameter down to tens of micrometers, the convective heat transfer coefficient $h \propto k/D_h$ reaches astronomical values (> 15,000 W/mยฒยทK), enabling heat removal from ultra-dense processors exceeding $100\,\text{W/cm}^2$.
Three-Component Thermal Resistance Budget
The total junction-to-fluid thermal resistance includes $R_{cond}$ (substrate base conduction), $R_{conv}$ (fin convective resistance), and $R_{cal}$ (caloric fluid temperature rise along channel).
Key Engineering Assumptions
- Laminar flow with Kwak rectangular duct aspect-ratio corrections.
- 1D fin conduction efficiency across high aspect ratio micro-fins.
- Applicable to NVIDIA/AMD AI GPUs, Intel Xeon/AMD EPYC CPUs, and automotive EV SiC traction inverters.